散熱接著 Silicone Adhesive and Sealant

Momentive的密封劑和粘合劑廣泛於電子應用中提升性能和生產力。設計符合械組裝及高速自動粘合點膠製成。Momentive提供高生產力組裝用的矽密封劑和快速固化矽粘合劑，以及針對電子元件的解決方案，這些解決方案可以提供設計靈活性，並在惡劣工作條件下説明確保長期元件可靠性。

Key Features

Primerless adhesion to many substrates
Fast cure
Long-term elasticity
Non-corrosiveness
One-component availability
Choice of cure systems

Typical Benefits

Broad application
Productivity, high outputs
Compensation for CTE mismatch
Reduced risk for electronics
Ease of use
Design flexibility

Potential Applications

Headlamp assemblies
ECU adhesion
Sensor adhesion
Wire connector seating
HVAC systems

Typical Physical Properties
(selected grades only; please contact us for material selection support)

Product	Cure (1)	System	Cure Time / Tack Free Time (3)	Color	Flowability	Feature
Addisil* 6101 adhesive sealant	AC	1 part	CT 10 min @ 125 °C	Black	Non-flowable	Fast bonding @ 125 °C
TSE322	AC	1 part	CT 30 min @ 150 °C	Light blue, Black	Flowable	Fast bonding @ T>125 °C
TSE326M-EX	AC	1 part	CT 1 hr @ 150 °C	Red	Flowable	High heat stability
TN3005	CC	1 part	TFT < 10 min @ RT	Clear, white, black	Non-flowable	Tin free/ Fast cure/ Low volatile
TN3305	CC	1 part	TFT < 10 min @ RT	Clear, white, black	Flowable	Tin free /Fast cure/ Low volatile
TN3085	CC	1 part	TFT < 10 min @ RT	White, grey	Non-flowable	Tin free/ Fast cure/ Low volatile
RTV210A / 224B	CC	2 part (10:1 w/w)	CT 15 min @ RT(2)	Black	Non-flowable	Fast bonding @ ambient

AC = Addition Cure, CC = Condensation Cure
After 10-30 minutes cure at RT the bond strength is usually sufficient to allow part handling - full cure obtained after 1-3 days at ambient
CT = Cure Time, TFI = Tack Free Time

Typical data are average data and are not to be used as or to develop specifications.
*Addisil is a trademark of Momentive Performance Materials GmbH.

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